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SILICON NITRIDE (Si3N4)
This material offers a hitherto unattainable combination of
outstanding properties:
- extremly high strength
- very high toughness
- excellent wear resistance
- very low thermal expansion
- high thermal conductivity
- outstanding thermal shock resistance
- very good chemical resistance
The sintering process of silicon nitride has to take place
by a very high mechanical pressure in a controlled atmosphere.
Depending on the process the result is:
- sintered silicon nitride (SSN)
- gas pressure sintered silicon nitride (GPSSN) or
- hot-pressed silicon nitride (HPSN)
In comparison reaction bonded nitride (RBSN) - starting substance
Si-powder - is nitrided shrink free in a specifically set N2-atmosphere. |
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SILICON ALUMINIUM OXYNITRIDE
(SIALON)
It is mainly based on compounds or solid solutions of a four-component
system silicon - aluminium - oxygen
- nitrogen.
On account of its fracture toughness it is often used for
- cutting tools. Due to the low wettability through non
ferrous metals, SIALON is a standard material for
- thermocouple protection tubes.
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ALUMINIUM NITRIDE (ALN)
An irresistible material due to its extraordinary high thermal
conductivity: up to 180 Wm-1 K-1. Moreover
the combination of properties speak for themselves:
- best thermal conductivity
- high electrical insulation
- thermal expansion similar to Si (‹Al2O3)
- inert behaviour towards melting of the III-V-compounds
- high rigidity.
ALN is especially suitable as
- substrat for semi-conducting components and
- power electronic modules.
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Further,
more detailed information to this in the Brevier |
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10. Mai 2005
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Nitride