8.2.4.1 Soft
Soldering
According to DIN 8505 soft solders melt
below 450 °C; typical soft solders melt between 150 and
250 °C. They are used at between 190 and 250 °C. Typical
solders include the eutectic systems of tin/lead (melting
point 183 °C) and tin/silver (melting point 221 °C).
The metallisation is usually based on a noble metals (silver,
silver/palladium, silver/platinum, gold, palladium/gold, platinum/gold).
Soft soldering is widely used in electrical engineering and
in electronics, particularly for hybrid circuits. As a rule,
passive and active components can withstand the temperature
stress involved in the soft soldering process.
The soldering temperature does, however, represent a temperature
shock to the metallised ceramic, although this is usually
not critical even for sensitive ceramic materials.
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